Title: Advances in Multi-Band IF, RF, and Microwave Active, Passive and Antenna Components for Aerospace, Defense and Space System Applications across L/S/C/X/Ku/K/Ka Bands

Organizers:

• Dr. Venkata Kishore Kothapudi, Center of Excellence Advanced RF Microwave & Wireless Communications, Department of Electronics and Communication Engineering, School of Electrical, Electronics and Communication Engineering, Vignan’s Foundation for Science, Technology, and Research (VFSTR), Vadlamudi, Guntur District, Andhra Pradesh 522213, India
  • Email: v.k.kothapudi@ieee.org / drkothapudi@gmail.com
  • Phone: +91-9247197629 / +91-9976599111
• Dr. Lakshman Pappula, Department of Electrical, Electronics and Communication Engineering, GITAM School of Technology, GITAM University, Visakhapatnam, Andhra Pradesh, India-530045
  • Email: lakshman.pappula@gmail.com
  • Phone: +91-9959545565

Proposal Summary:

The evolution of modern aerospace, defense, and space systems increasingly relies on compact, high-efficiency, and high-frequency RF, IF, and microwave solutions operating from UHF to mm-wave bands. This special session will highlight recent advancements in the design, integration, and testing of active and passive multi-band components—including amplifiers, filters, oscillators, and antenna subsystems—capable of supporting diverse applications across L, S, C, X, Ku, K, Ka, V, W, and mm-wave frequency ranges.

In addition to core components, this session will emphasize critical innovations in beamforming and feeding network architectures, such as hybrid couplers, 90° and 180° directional couplers, unequal power dividers/combiners, baluns, and phase-compensated structures, which are essential to implementing phased arrays, MIMO, and adaptive antenna systems in space-constrained platforms. These elements are key enablers of advanced electronic warfare (EW), radar, secure communications, and satellite payload systems.

This session aims to gather leading researchers, industry experts, and professionals in RF/microwave technology to discuss the latest research, design methodologies, material innovations, and system integration strategies. Emphasis will be placed on both theoretical and applied research, covering components such as amplifiers, filters, oscillators, phase shifters, and complex feeding and beamforming networks that meet stringent requirements for multi-band functionality in radar, satellite communications, electronic warfare, and secure communication systems.

Scope and Relevance:

This session will serve as a platform for presenting cutting-edge advancements in RF and microwave components specifically designed for multi-band applications. Topics of interest will include active and passive components, covering the entire range of RF, IF, and microwave frequencies. As the defense and aerospace industries push toward higher frequencies and more compact, integrated solutions, there is a critical need to address both design and practical implementation challenges associated with multi-band performance.

The proposed session aligns with the objectives of the IEEE PIERS conference by advancing knowledge in the electromagnetic community and fostering the development of new, multi-functional technologies that will play a significant role in future defense and aerospace systems.

Topics of Interest:

We invite contributions on a wide range of topics related to RF, IF, and microwave multi-band components, including but not limited to:

Active RF Components:

1. Multi-Band RF Power Amplifiers - High-efficiency amplifiers optimized for power, linearity, and thermal stability across multiple bands.
2. Low Noise Amplifiers (LNAs) - Advanced LNAs that minimize noise while offering wideband functionality for enhanced system sensitivity.
3. Oscillators and Synthesizers - Precision oscillators and synthesizers for reliable frequency generation across L/S/C/X/Ku/K/Ka bands.
4. Digital Phase Shifters and Attenuators - Multi-band, digitally controlled devices for precise phase adjustment and signal control.
5. RF Switches and T/R Switches - Fast, low-loss switches optimized for multi-band operation in dynamic RF systems.

Passive RF Components:

1. Antenna Arrays - Innovations in phased arrays and shared aperture antennas that enable compact, multi-band operation with high directional accuracy.
2. Frequency Mixers and Multipliers - Multi-band frequency translation and generation solutions essential for signal processing.
3. Power Splitters/Combiners - Components for efficient multi-band signal distribution and combination in phased arrays and multi-channel systems.
4. Directional Couplers and Branch Line Couplers - Devices for accurate power monitoring and signal routing across multiple bands.
5. RF Chokes and Terminations - Essential for isolating RF from DC and achieving minimal reflection across frequencies.
6. Impedance Matching Pads - Solutions for maximum power transfer and optimal impedance matching in multi-band environments.
7. Transformers - High-frequency transformers tailored for efficient signal transfer in multi-band systems.

Additional RF, IF, and Microwave Components:

1. Adapters and Cables - High-quality connectors and cables that maintain signal integrity across multi-band frequencies.
2. Bias Tees and DC Blocks - Components essential for separating AC and DC signals, enhancing multi-band circuit performance.
3. Filters (Multi-Band and Tunable) - Advanced filtering solutions to reduce interference and maintain signal clarity across bands.
4. Limiters and Power Detectors - Devices for signal protection and power monitoring in high-power, multi-band RF systems.
5. Modulators/Demodulators - Critical for multi-band communication, enabling signal modulation and demodulation with high accuracy.
6. Phase Detectors - Devices crucial for phase alignment and processing in multi-band applications.

Beamforming and Feeding Networks:

• Series and Parallel Feed Networks

• Hybrid and Multi-Layer Beamforming Architectures

• Unequal and Phased Power Feeding Schemes

• Reconfigurable Networks and Integrated Phase Control

• High-Isolation, Low-Loss Distribution Networks for Adaptive Arrays

System Integration & Reliability:

• Environmental Qualification and Multi-Band Testing Strategies

• Packaging, Thermal Management, and Miniaturization Techniques

• Integration of Multi-Band Subsystems into Aerospace Platforms

Objectives:

The session aims to:

1. Showcase Recent Innovations: Highlight the latest research, designs, and methodologies that advance the field of multi-band RF, IF, and microwave components for defense and aerospace.
2. Address Integration Challenges: Discuss challenges and solutions in integrating compact, high-performance, multi-band components into complex defense and aerospace systems.
3. Promote Industry-Academia Collaboration: Foster networking and knowledge exchange between researchers, engineers, and industry professionals, encouraging collaboration on future multi-band RF projects.
4. Explore Future Trends: Identify key trends, technological gaps, and promising research directions for developing next-generation RF/microwave components.

Expected Outcomes:

The session will provide participants with:

1. Comprehensive Knowledge: A deep understanding of state-of-the-art techniques, materials, and architectures that enable multi-band performance.
2. Practical Insights: Real-world applications and solutions that can be leveraged in defense, aerospace, and telecommunications projects.
3. Networking Opportunities: Engagement with leading experts for potential collaboration and exchange of ideas.
4. Vision for Future Research: Insights into emerging technologies, challenges, and trends that will guide future research in multi-band RF/microwave engineering.

Target Audience:

This session is aimed at:

• Researchers, engineers, and scientists specializing in RF/microwave engineering and multi-band component design.
• Defense and aerospace professionals focused on radar, satellite, and secure communication technologies.
• Technology developers and industry leaders in the electromagnetic component sector.
• Academics, students, and emerging professionals seeking exposure to multi-band RF technologies and applications.

Contact Information:

• Lead Organizer: Dr. Venkata Kishore Kothapudi, Vignan's Foundation for Science, Technology and Research, Department of Electronics and Communication Engineering, India
  • Email: v.k.kothapudi@ieee.org / drkothapudi@gmail.com 
  • Phone: +91-9247197629 / +91-9976599111
• Co-Organizer: Dr. Lakshman Pappula, Department of Electrical, Electronics and Communication Engineering, GITAM School of Technology, GITAM University, Visakhapatnam, Andhra Pradesh, India-530045
  • Email: lakshman.pappula@gmail.com
  • Phone: +91-9959545565